FCInc. Special Material

FCInc. Specialized Manufacturing Capabilities

• JP-Copper clad plated materials
  JP-Aluminum clad plated materials
• Rigid, Rigid-Flex and Flex
• Roger, Arlon, Polyimide pcb's
• Laser microvias with both blind and buried vias and also controlled depth drilling capabilities.
• High-density interconnect (HDI) with extremely fine line circuitry and ultra-fine pitch surface mount.
• RF/microwave applications utilizing high performance materials from Rogers, Taconic and Arlon.
• A variety of surface finishes that include: OSP (ENTEK PLUS), HASL, Electroless Nickel/Immersion Gold, and Electroless Nickel/Electroless Gold.
• High aspect ratio plating up to 15 :1
• Laser skiving cover sheet for flex circuit applications.
• Layer count lamination available up to 16 layers with controlled impedance.

For more information call us today.