Welcome to Fine Circuits

Fine Circuits Inc. Special Material

FCInc. Specialized Manufacturing Capabilities

FR-4

a multifunctional epoxy system that is used as our standard multilayer material.

FR-4/170Tg

a Multifunctional Epoxy Laminate and Prepreg that has a Tg of 170 C (DSC). We see FR-406 being used in applications where a higher temperature material is needed. It produces high yields using standard FR-4 processing.

FR-4/180Tg

a high-performance FR-4 epoxy laminate and prepreg that has a Tg of 180 C (DSC). Its low dielectric constant is an ideal for faster signal speed and improved signal integrity. We recommend this material when layer counts begin to exceed 8 layers because it's higher thermal properties minimize Z-axis expansion and the potential for barrel cracking and pad lifting in complex designs.

JP-Copper clad plated materials
JP-Aluminum clad plated materials
Rigid, Rigid-Flex and Flex
Roger, Arlon, Polyimide pcb's
Laser microvias with both blind and buried vias and also controlled depth drilling capabilities.
High-density interconnect (HDI) with extremely fine line circuitry and ultra-fine pitch surface mount.
RF/microwave applications utilizing high performance materials from Rogers, Taconic and Arlon.
A variety of surface finishes that include: OSP (ENTEK PLUS), HASL, Electroless Nickel/Immersion Gold, and Electroless Nickel/Electroless Gold.
High aspect ratio plating up to 15 :1
Laser skiving cover sheet for flex circuit applications.
Layer count lamination available up to 16 layers with controlled impedance.

For more information call us today.