Free Estimates - Bartlett, IL: 630-213-8700

Special Material

We use only high quality materials to provide you with the best products. To learn more about our specialized manufacturing capabilities, review the list below. Contact us with any questions you may have by <clicking here>.

Fine Circuits Specialized Manufacturing Capabilities
  • FR-4:
    • Multi-functional epoxy system
    • Used as our standard multilayer material
  • FR-4/170Tg
    • Multi-functional Epoxy Laminate and Prepreg
    • Tg of 170 C (DSC)
    • FR-406 can be used in applications where a higher temperature material is needed
    • Produces high yields using standard FR-4 processing
  • FR-4/180Tg
    • High-performance FR-4 epoxy laminate and prepreg
    • Tg of 180 C (DSC)
    • Llow dielectric constant is an ideal for faster signal speed and improved signal integrity
    • Material is recommneded when layer counts begin to exceed 8 layers
    • Higher thermal properties minimize Z-axis expansion and the potential for barrel cracking and pad lifting in complex designs
  • JP-Copper clad plated materials
  • JP-Aluminum clad plated materials
  • Rigid, Rigid-Flex and Flex
  • Roger, Arlon, Polyimide pcb’s
  • Laser microvias
    • Both blind and buried vias
    • Controlled depth drilling capabilities
  • High-density interconnect (HDI)
    • Extremely fine line circuitry
    • Ultra-fine pitch surface mount
  • RF/microwave applications
    • Utilizing high performance materials from Rogers, Taconic and Arlon
  • Variety of surface finishes:
    • Including:
    • HASL
    • Electroless Nickel/Immersion Gold
    • Electroless Nickel/Electroless Gold
  • High aspect ratio plating up to 15:1
  • Laser skiving cover sheet for flex circuit applications.
  • Layer count lamination available up to 16 layers with controlled impedance.

For pricing and other questions call us today.